The BGA Designer Suite automates the design of all types of BGA technologies including Wire Bonded, Flip Chip, Chip Scale, Wafer Scale, Flex, and TAB Bonded. Supports substrates: Organic, Ceramic (LTCC) and Flex. Cavity type designs, facing up or down, with any number of shelves are fully supported with optional vertical metal on the shelf edges. Build your Own Suite: The BGA Suite may also be customized by adding other products from CDS. You can add other, and to build a design suite to fit your exact needs for a value price. Key Features: • Bond-finger / bond-wire fanout uses parametric controls for unlimited creative flexibility • Automatic creation of JEDEC or custom BGAs including reading in an MS Excel® file with Netnames and Class names initialized • Automatic and interactive Netlist Creation tools for single chips and MCMs • Support for all package types including new technologies BGA, MCM, CSP, BUM, WSP, etc.

Software Powered by iCIMS www.icims.com. Welcome to the Careers Center for Eddie Bauer. Please browse all of our available job and career opportunities. BAUER IR PRO SCC V.4 BGA rework station with IR and Hot air 2 in 1 top heat system. The IR PRO SCC V4 features a unique new 2 in 1 top heat system where the user can easily change between IR & Air featuring a 500 watt Dark IR and 800 watt Hot Air system.

Customized Solutions Not only does CDS provide feature-rich Electronic Design Automation (EDA) layout solutions, we also consult with clients to create custom circuit design solutions to smooth out their specific development flows. Bogolyubov uchebnik po chercheniyu. Over the past 18 years, CDS has worked with customers to develop many custom software solutions. We pride ourselves in adapting the software to the customers' needs, and not asking the customer to adapt their flow to the software’s functions. CDS also writes customer data that links to Epoxy Dispense, Die Placement and All Types of Wire Bonding Machines.

Caltex innovative 3D rotational view plus 90° BGA inspection mirror provide unprecedented optical BGA inspection capability at 90° view for QC and failure analysis at very affordable price for circuit board manufacturers using BGA and QFP. The system is very easy to use and extremely robust for production environment. Real time view of BGA inspection, capturing defect image for documentation, and performing dimensional measurement on BGA ball size and pitch, all with better image clarity and less expensive than X-ray system.

• 1080p HD 6MP camera for real-time HD image inspection • 3D rotational mirror to see BGA side view in real time 3D • Capture image without a computer • Measure software included for computer USB2.0 connection.